Qualcomm
            
            
                
                
                    
                        
	Product Technical Specifications
	
	
		
			| 
				EU RoHS
			 | 
			
				Compliant  
			 | 
		
		
			| 
				ECCN (US)
			 | 
			
				5A992.c 
			 | 
		
		
			| 
				Part Status
			 | 
			
				Unconfirmed 
			 | 
		
		
			| 
				Type
			 | 
			
				Chip 
			 | 
		
		
			| 
				Standard Package Name
			 | 
			
				BGA 
			 | 
		
		
			| 
				Pin Count
			 | 
			
				169 
			 | 
		
		
			| 
				Supplier Package
			 | 
			
				TFBGA 
			 | 
		
		
			| 
				Mounting
			 | 
			
				Surface Mount 
			 | 
		
		
			| 
				Package Height
			 | 
			
				1.2 
			 | 
		
		
			| 
				Package Length
			 | 
			
				8 
			 | 
		
		
			| 
				Package Width
			 | 
			
				8 
			 | 
		
		
			| 
				PCB changed
			 | 
			
				169 
			 | 
		
		
			| 
				Lead Shape
			 | 
			
				Ball 
			 | 
		
	
		
                    
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