Qualcomm
Product Technical Specifications
EU RoHS
|
Compliant
|
ECCN (US)
|
5A992.c
|
Part Status
|
Unconfirmed
|
Type
|
Chip
|
Standard Package Name
|
BGA
|
Pin Count
|
169
|
Supplier Package
|
TFBGA
|
Mounting
|
Surface Mount
|
Package Height
|
1.2
|
Package Length
|
8
|
Package Width
|
8
|
PCB changed
|
169
|
Lead Shape
|
Ball
|
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